Datasheet


       

SLVS009F − JUNE 1976 − REVISED FEBRUARY 2005
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
AVAILABLE OPTIONS
PACKAGED DEVICES
CHIP
T
A
SMALL-OUTLINE
(D)
PLASTIC DIP
(N)
SHRINK
SMALL-OUTLINE
(PW)
CHIP
FORM
(Y)
0°C to 70°C TL497ACD TL497ACN TL497ACPW TL497AY
−40°C to 85°C TL497AID TL497AIN — —
The D and PW packages are only taped and reeled. Add the suffix R to the device type (e.g.,
TL497ACPWR). Chip forms are tested at 25°C.
functional block diagram
BASE
†
11
12
BASE DRIVE
†
CUR LIM SENS
FREQ CONTROL
INHIBIT
SUBSTRATE
COMP INPUT
CATHODE
Current
Limit
Sense
13
3
2
1
4
6
1.2-V
Reference
10
8
7
COL OUT
EMIT OUT
ANODE
Oscillator
†
BASE and BASE DRIVE are used for device testing only. They normally are not used in circuit applications of the device.