Datasheet

 
 
 

SLCS132C − MARCH 1997 − REVISED MAY 1997
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TL3116Y chip information
This chip, when properly assembled, displays characteristics similar to the TL3116C. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 10 MILS TYPICAL
BONDING PADS: 4 × 4 MILS MINIMUM
T
J
max = 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
TERMINALS 1 AND 6 CAN BE
CONNECTED TO MULTIPLE PADS.
Q OUT
IN−
IN+
LATCH ENABLE
Q OUT
(5)
(2)
(3)
(1)
(6)
V
CC+
GND
(7)
(8)
+
−
V
CC−
(4)
55
63
(1)
(4)
(3)
(2)
(5)
(1)
(1)
(8)
(7)
(6)
(6)
(6)
COMPONENT COUNT
Bipolars 53
MOSFETs 49
Resistors 46
Capacitors 14