Datasheet

TL3016, TL3016Y
ULTRA-FAST LOW-POWER
PRECISION COMPARATORS
SLCS130D – MARCH 1997 – REVISED MARCH 2000
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TL3016Y chip information
This chip displays characteristics similar to the TL3016C. Thermal compression or ultrasonic bonding may be
used on the doped-aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon
preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 10 MILS TYPICAL
BONDING PADS: 4 × 4 MILS MINIMUM
T
J
max = 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
TERMINALS 1 AND 6 CAN BE
CONNECTED TO MULTIPLE PADS.
Q OUT
IN–
IN+
LATCH ENABLE
Q OUT
(5)
(2)
(3)
(1)
(6)
V
CC+
GND
(7)
(8)
+
–
55
63
V
CC–
(4)
(1)
(4)
(3)
(2)
(5)
(1)
(1)
(8)
(7)
(6)
(6)
(6)
COMPONENT COUNT
Bipolars 53
MOSFETs 49
Resistors 46
Capacitors 14