Datasheet

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SLVS072C − DECEMBER 1992 − REVISED OCTOBER 1995
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
POST OFFICE BOX 1443
• HOUSTON, TEXAS
77251−1443
8−4
600
400
200
0
25 50 75 100
800
1000
1200
125 150
1800
1600
1400
2000
2200
2400
FREE-AIR TEMPERATURE
DISSIPATION DERATING CURVE
T
A
− Free-Air Temperature − °C
Maximum Continuous Power Dissipation − mW
1200
800
400
0
25 50 75 100
1600
2000
2400
125 150
3600
3200
2800
4000
4400
4800
CASE TEMPERATURE
DISSIPATION DERATING CURVE
T
C
− Case Temperature − °C
R
θJA
= 151°C/W
R
θJC
= 31°C/W
Maximum Continuous Power Dissipation − mW
Figure 1 Figure 2
1200
800
400
0
25 50 75 100
2000
125 150
3600
3200
2800
4000
4400
4800
LEAD TEMPERATURE
DISSIPATION DERATING CURVE
T
L
− Lead Temperature − °C
2400
1600
†
R
θJL
= 50.5°C/W
Maximum Continuous Power Dissipation − mW
Figure 3
†
R
θJL
is the thermal resistance between the junction and device lead. To determine the virtual junction temperature (T
J
) relative to the device lead
temperature, the following calculations should be used: T
J
= P
D
x R
θJL
+ T
L
, where P
D
is the internal power dissipation of the device, and T
L
is
the device lead temperature at the point of contact to the printed wiring board. R
θJL
is 50.5°C/W.