Datasheet

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
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SLVS072C − DECEMBER 1992 − REVISED OCTOBER 1995
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
POST OFFICE BOX 1443
• HOUSTON, TEXAS
77251−1443
8−2
AVAILABLE OPTIONS
T
J
SURFACE MOUNT
(PW)
†
CHIP FORM
(Y)
0°C to 125°C TL2218-285PWLE TL2218-285Y
†
The PW package is only available left-end taped and reeled.
TL2218-285Y chip information
This chip, when properly assembled, displays characteristics similar to the TL2218-285. Thermal compression
or ultrasonic bonding may be used on the doped aluminum bonding pads. The chip may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 11 MILS TYPICAL
BONDING PADS: 4 × 4 MILS MINIMUM
T
J
max = 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
Thermal
Regulation
Feedback
Active
Negation
Clamp
TERMPWR
1, 20
4
19
V
ref
DISABLE
D0
Common to All Channels
161
84
(1)
(4)
(5)
(6)
(7)
(8)
(10)(11)
(13)
(14)
(16)
(17)
(19)
(20)