Datasheet

PACKAGE OPTION ADDENDUM
www.ti.com
27-Jul-2013
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
TL16C550DPFBR ACTIVE TQFP PFB 48 1000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR 0 to 70 550DPFB
TL16C550DPFBRG4 ACTIVE TQFP PFB 48 1000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR 0 to 70 550DPFB
TL16C550DPT ACTIVE LQFP PT 48 250 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR 0 to 70 TA550D
TL16C550DPTG4 ACTIVE LQFP PT 48 250 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR 0 to 70 TA550D
TL16C550DPTR ACTIVE LQFP PT 48 1000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR 0 to 70 TA550D
TL16C550DPTRG4 ACTIVE LQFP PT 48 1000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR 0 to 70 TA550D
TL16C550DRHB ACTIVE VQFN RHB 32 73 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR 0 to 70 550D
TL16C550DRHBG4 ACTIVE VQFN RHB 32 73 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR 0 to 70 550D
TL16C550DRHBR ACTIVE VQFN RHB 32 3000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR 0 to 70 550D
TL16C550DRHBRG4 ACTIVE VQFN RHB 32 3000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR 0 to 70 550D
TL16C550DZQSR ACTIVE BGA
MICROSTAR
JUNIOR
ZQS 24 2500 Green (RoHS
& no Sb/Br)
SNAGCU Level-1-260C-UNLIM 0 to 70 550D
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.