Datasheet

 
  
 
SLVS423 A− MAY 2002 − REVISED SEPTEMBER 2002
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TL1454AY chip information
This device, when properly assembled, displays characteristics similar to the TL1454AC. Thermal compression
or ultrasonic bonding may be used on the doped aluminum bonding pads. The chips may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
T
J
max = 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
TL1454AY
(2)
(14)
(1)
(3)
(4)
(5)
(6)
(7)
(8)
(16)
(13)
(12)
(11)
(10)
(9)
REF
DTC2
IN2+
IN2−
COMP2
V
CC
OUT2OUT1
COMP1
IN1−
IN1+
RT
CT
GND
86
108
(1)
(2) (3)
(4) (5) (6) (7)
(10)(11)
(12)(13)(14)(15)
(16)
(8)
(9)
(15)
SCP
DTC1