Datasheet

TL081, TL081A, TL081B, TL082, TL082A, TL082B
TL082Y, TL084, TL084A, TL084B, TL084Y
JFET-INPUT OPERATIONAL AMPLIFIERS
SLOS081D – FEBRUARY 1977 – REVISED FEBRUARY 1997
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
• 3
AVAILABLE OPTIONS
PACKAGED DEVICES
CHIP
T
A
V
IO
max
AT 25°C
SMALL
OUTLINE
(D008)
SMALL
OUTLINE
(D014)
CHIP
CARRIER
(FK)
CERAMIC
DIP
(J)
CERAMIC
DIP
(JG)
PLASTIC
DIP
(N)
PLASTIC
DIP
(P)
TSSOP
(PW)
FLAT
PACK
(U)
FLAT
PACK
(W)
CHIP
FORM
(Y)
15 mV
6 mV
3 mV
TL081CD
TL081ACD
TL081BCD
— — — — —
TL081CP
TL081ACP
TL081BCP
TL081CPW
— — —
0°C
to
70°C
15 mV
6 mV
3 mV
TL082CD
TL082ACD
TL082BCD
— — — — —
TL082CP
TL082ACP
TL082BCP
TL082CPW
— —
TL082Y
15 mV
6 mV
3 mV
—
TL084CD
TL084ACD
TL084BCD
— — —
TL084CN
TL084ACN
TL084BCN
—
TL084CPW
— —
TL084Y
–40°C
to
85°C
6 mV
6 mV
6 mV
TL081ID
TL082ID
TL084ID
TL084ID
— — —
TL084IN
TL081IP
TL082IP
— — — —
–55°C
to
125°C
6 mV
6 mV
9 mV
— —
TL081MFK
TL082MFK
TL084MFK
TL084MJ
TL081MJG
TL082MJG
— — —
TL081MU
TL082MU
TL084MW
—
The D package is available taped and reeled. Add R suffix to the device type (e.g., TL081CDR).