Datasheet

TL061, TL061A, TL061B, TL061Y, TL062, TL062A
TL062B, TL062Y, TL064, TL064A, TL064B, TL064Y
LOW-POWER JFET-INPUT OPERATIONAL AMPLIFIERS
SLOS078F – NOVEMBER 1978 – REVISED JANUARY 1999
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TL064Y chip information
This chip, when properly assembled, has characteristics similar to the TL064. Thermal compression or
ultrasonic bonding can be used on the doped-aluminum bonding pads. The chips can be mounted with
conductive epoxy or a gold-silicon preform.
Bonding-Pad Assignments
Chip Thickness: 15 Mils Typical
Bonding Pads: 4 × 4 Mils Minimum
T
J
(max) = 150°C
Tolerances Are ±10%.
All Dimensions Are in Mils.
Pin (11) is Internally Connected
to Backside of Chip.
+
–
1OUT
1IN+
1IN–
V
CC+
(4)
(6)
(3)
(2)
(5)
(1)
–
+
(7)
2IN+
2IN–
2OUT
(11)
V
CC–
+
–
4OUT
4IN+
4IN–
(13)
(10)
(9)
(12)
(8)
–
+
(14)
3OUT
3IN+
3IN–
60
110
(13)
(14)
(1)
(2)
(3) (5) (6)
(7)
(8)
(9)
(10)
(12)
(11)
(4)