Datasheet

TL061, TL061A, TL061B, TL061Y, TL062, TL062A
TL062B, TL062Y, TL064, TL064A, TL064B, TL064Y
LOW-POWER JFET-INPUT OPERATIONAL AMPLIFIERS
SLOS078F – NOVEMBER 1978 – REVISED JANUARY 1999
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TL062Y chip information
This chip, when properly assembled, has characteristics similar to the TL062. Thermal compression or
ultrasonic bonding can be used on the doped-aluminum bonding pads. The chips can be mounted with
conductive epoxy or a gold-silicon preform.
Bonding-Pad Assignments
Chip Thickness: 15 Mils Typical
Bonding Pads: 4 × 4 Mils Minimum
T
J
(max) = 150°C
Tolerances Are ±10%.
All Dimensions Are in Mils.
Pin (4) is Internally Connected to Backside of Chip.
+
–
1OUT
1IN+
1IN–
V
CC+
(8)
(6)
(3)
(2)
(5)
(1)
–
+
(7)
2IN+
2IN–
2OUT
(4)
V
CC–
66
49
(6) (5)
(4)
(3)(2)(1)
(8)
(7)