Datasheet

TL061, TL061A, TL061B, TL061Y, TL062, TL062A
TL062B, TL062Y, TL064, TL064A, TL064B, TL064Y
LOW-POWER JFET-INPUT OPERATIONAL AMPLIFIERS
SLOS078F – NOVEMBER 1978 – REVISED JANUARY 1999
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TL061Y chip information
This chip, when properly assembled, has characteristics similar to the TL061. Thermal compression or
ultrasonic bonding can be used on the doped-aluminum bonding pads. The chips can be mounted with
conductive epoxy or a gold-silicon preform.
Bonding-Pad Assignments
+
–
OUT
IN+
IN–
V
CC+
(7)
(3)
(2)
(6)
(4)
V
CC–
(1)
(5)
OFFSET N1
OFFSET N2
Chip Thickness: 15 Mils Typical
Bonding Pads: 4 × 4 Mils Minimum
T
J
(max) = 150°C
Tolerances Are ±10%.
All Dimensions Are in Mils.
Pin (4) is Internally Connected
to Backside of Chip.
41
53
(6)
(7)
(8)
(1) (2)
(3)
(4)(5)