Datasheet

TL061 , TL061A , TL061B
TL062 , TL062A , TL062B , TL064 , TL064A , TL064B
www.ti.com SLOS078L –NOVEMBER 1978–REVISED MAY 2015
6.2 ESD Ratings
VALUE UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
2000
V
(ESD)
Electrostatic discharge V
Charged-device model (CDM), per JEDEC specification JESD22-
2000
C101
(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CC+
Supply voltage 5 15 V
V
CC–
Supply voltage –5 –15 V
V
CM
Common-mode voltage V
CC–
+ 4 V
CC+
– 4 V
TL06xM –55 125
TL06xQ –40 125
T
A
Ambient temperature °C
TL06xI –40 85
TL06xC 0 70
6.4 Thermal Information - 8 Pins
TL06xx
THERMAL METRIC
(1)
D (SOIC) P (PDIP) PS (SO) PW (TSSOP) JG (CDIP) UNIT
8 PINS 8 PINS 8 PINS 8 PINS 8 PINS
R
θJ
Junction-to-ambient thermal
97 85 95 149 — °C/W
A
resistance
(2)(3)
R
θJ
Junction-to-case (top) thermal
C(to
— — — — 14.5 °C/W
resistance
(4)(5)
p)
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
(2) Maximum power dissipation is a function of T
J(max)
, R
θJA
, and T
A
. The maximum allowable power dissipation at any allowable ambient
temperature is P
D
= (T
J(max)
– T
A
)/R
θJA
. Operating at the absolute maximum T
J
of 150°C can affect reliability.
(3) The package thermal impedance is calculated in accordance with JESD 51-7.
(4) Maximum power dissipation is a function of T
J(max)
, R
θJC
, and T
C
. The maximum allowable power dissipation at any allowable ambient
temperature is P
D
= (T
J(max)
– T
C
) / R
θJC
. Operating at the absolute maximum T
J
of 150°C can affect reliability.
(5) The package thermal impedance is calculated in accordance with MIL-STD-883.
6.5 Thermal Information - 14 Pins
TL06xx
D (SOIC) N (PDIP) NS (SO) PS (SO) PW J (CDIP) W (CFP)
THERMAL METRIC
(1)
UNIT
(TSSOP)
14 PINS 14 PINS 14 PINS 8 PINS 14 PINS 14 PINS 14 PINS
R
θJ
Junction-to-ambient thermal 113
86 80 76 95 — — °C/W
A
resistance
(2)(3)
R
θJ
Junction-to-case (top) thermal
C(to
— — — — — 15.05 14.65 °C/W
resistance
(2)(3)
p)
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
(2) Maximum power dissipation is a function of T
J(max)
, R
θJC
, and T
C
. The maximum allowable power dissipation at any allowable ambient
temperature is P
D
= (T
J(max)
– T
C
) / R
θJC
. Operating at the absolute maximum T
J
of 150°C can affect reliability.
(3) The package thermal impedance is calculated in accordance with MIL-STD-883.
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