Datasheet

THS8136
www.ti.com SLES236B –NOVEMBER 2008–REVISED APRIL 2013
ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range (unless otherwise noted)
AV
DD
to AV
SS
–0.5 V to 3.6 V
Supply voltage DV
DD
to DV
SS
–0.5 V to 1.95 V
AV
SS
to DV
SS
–0.5 to 0.5 V
Digital input voltage range to DV
SS
–0.5 V to (DV
DD
+ 0.5) V
T
A
Operating free-air temperature range –40°C to 85°C
T
stg
Storage temperature range –55°C to 150°C
Human-body model (HBM)
(3)
, All pins >2000 V
V
ESD
ESD stress voltage
(2)
Charged-device model (CDM)
(4)
, All pins >500 V
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Electrostatic discharge (ESD) to measure device sensitivity/immunity to damage caused by electrostatic discharges into the device.
(3) Level listed is the passing level per ANSI/ESDA/JEDEC JS-001-2010 and AEC Q100-002 rev D. JEDEC document JEP155 states that
500-V HBM allows safe manufacturing with a standard ESD control process, and manufacturing with less than 500-V HBM is possible if
necessary precautions are taken. Pins listed as 2000 V may actually have higher performance.
(4) Level listed is the passing level per EIA-JEDEC JESD22-C101E and AEC Q100-011 rev B. JEDEC document JEP157 states that 250-V
CDM allows safe manufacturing with a standard ESD control process. Pins listed as 500 V may actually have higher performance.
Corner pins meet the AEC Q100-011 rev B 750-V requirement.
THERMAL SPECIFICATIONS
PARAMETER TEST CONDITIONS
(1)
MIN TYP MAX UNIT
Thermal PAD soldered to 4-layer High-K
29.11 °C/W
PCB
θ
JA
Junction-to-ambient thermal resistance, still air
Low-K PCB, Thermal PAD not soldered 64.42 °C/W
θ
JC
Junction-to-case thermal resistance, still air 0.12
Maximum junction temperature for reliable
T
J(MAX)
105 °C
operation
(1) When split ground planes are used, attach the thermal pad to the analog ground plane.
RECOMMENDED OPERATING CONDITIONS
MIN NOM MAX UNIT
Power Supply
AV
DD
3 3.3 3.6 V
DV
DD
1.65 1.8 1.95 V
Digital and Reference Inputs
V
IH
High-level input voltage 1.2 DV
DD
V
V
IL
Low-level input voltage DV
SS
0.7 V
f
CLK
Clock frequency 0 180 MHz
CLK
t
w(CLKH)
Pulse duration, clock high 40% 60%
period
CLK
t
w(CLKL)
Pulse duration, clock low 40% 60%
period
R
FS(nom)
FSADJ resistor
(1)
3.8 kΩ
(1) R
FS
should be chosen such that the maximum full-scale DAC output current (I
FS
) does not exceed the maximum stated level. This yields
the nominal output voltage compliance at the nominal load termination of 37.5 Ω.
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