Datasheet
1
24
23
22 21
20
19
18
17
16
15
14
13
1211
10
98
7
6
5
4
3
2
NC
NC
V
S+
NC
V
OUT-
V
OUT+
NC
NC
V
IN+
V
IN-
PD
140Ω
V
OCM
50Ω
50Ω
V
S+
V
S+
V
S+
GS+
GS-
Unused
Unused
200Ω
60Ω
2Ω
140Ω
200Ω
60Ω
2Ω
-
-
+
+
V
OCM
NC
GND
GND
GND
GND
THS770012
SLOS669C –FEBRUARY 2010–REVISED JANUARY 2012
www.ti.com
PIN CONFIGURATION
RGE PACKAGE
VQFN-24
(TOP VIEW)
PIN DESCRIPTIONS
PIN
DESCRIPTION
NO. NAME
1 NC No internal connection
2 PD Power down. High = low power (sleep) mode. Low = active.
3 V
IN–
Inverting input pin
4 V
IN+
Non-inverting input pin
5 V
OCM
Output common-mode voltage control input pin
6, 7 NC No internal connection
8, 9, 10, 11 GND Ground. Must be connected to thermal pad.
12 NC No internal connection
13 GS- Gain-setting connection for inverting output
14 Unused Bonded to die, but not used. Tie to GND.
15 V
OUT–
Inverting output pin
16 V
OUT+
Non-inverting output pin
17 Unused Bonded to die, but not used. Tie to GND.
18 GS+ Gain-setting connection for non-inverting output
19 NC No internal connection
20, 21, 22,
V
S+
Power supply pins, +5V nominal
23
24 NC No internal connection
Thermal pad Thermal pad on bottom of device is used for heat dissipation and must be tied to GND
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Product Folder Link(s): THS770012