Datasheet

100W
50W
50W
100W
V
OCM
NC
PD
V
IN-
V
IN+
V
OCM
NC
NC
Unused
V
OUT+
V
OUT-
Unused
NC
1
2
3
4
5
6
18
17
16
15
14
13
NC
24
NC
7
V
S+
23
GND
8
V
S+
22
GND
9
V
S+
21
GND
10
V
S+
20
GND
11
NC
19
NC
12
THS770006
SBOS520B –JULY 2010–REVISED JANUARY 2012 www.ti.com
PIN CONFIGURATION
RGE PACKAGE
VQFN-24
(TOP VIEW)
PIN DESCRIPTIONS
PIN
NO. NAME DESCRIPTION
1 NC No internal connection
2 PD Power down. High = low power (sleep) mode. Low = active.
3 V
IN–
Inverting input pin
4 V
IN+
Noninverting input pin
5 V
OCM
Output common-mode voltage control input pin
6, 7 NC No internal connection
8, 9, 10, 11 GND Ground. Must be connected to thermal pad.
12, 13 NC No internal connection
14 Unused Bonded to die, but not used. Tie to GND.
15 V
OUT–
Inverting output pin
16 V
OUT+
Noninverting output pin
17 Unused Bonded to die, but not used. Tie to GND.
18, 19 NC No internal connection
20, 21, 22,
V
S+
Power supply pins, +5V nominal
23
24 NC No internal connection
Thermal pad Thermal pad on bottom of device is used for heat dissipation and must be tied to GND
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Product Folder Link(s): THS770006