Datasheet

THS770006
www.ti.com SBOS520B –JULY 2010–REVISED JANUARY 2012
ELECTRICAL CHARACTERISTICS (continued)
Test conditions are at T
A
= +25°C, V
S+
= +5V, V
OCM
= +2.5V, V
OUT
= 2V
PP
, R
L
= 400Ω differential, G = +6dB, differential input
and output, and input and output referenced to midsupply, unless otherwise noted. Measured using evaluation module as
discussed in Test Circuits section.
TEST
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT LEVEL
(1)
POWER SUPPLY
Specified operating voltage 4.75 5 5.25 V C
T
A
= +25°C 85 100 115 mA A
Quiescent current
T
A
= –40°C to +85°C 80 125 mA B
T
A
= +25°C, VCC ±0.25V 60 90 dB A
Power-supply rejection ratio
T
A
= –40°C to +85°C, VCC ±0.5V 59 dB B
POWER-DOWN
Enable voltage threshold Device powers on below 0.5V 0.5 V A
Disable voltage threshold Device powers down above 2.0V 2 V A
Power-down quiescent current 0.8 3 mA A
Input bias current 80 100 µA A
Turn-on time delay Time to V
OUT
= 90% of final value 10 µs C
Turn-off time delay Time to V
OUT
= 10% of original value 0.15 µs C
THERMAL CHARACTERISTICS
Specified operating range –40 +85 °C C
Thermal resistance, θ
JC
(3)
Junction to case (bottom) 8.9 °C/W C
Thermal resistance, θ
JA
(3)
Junction to ambient 44.1 °C/W C
(3) Tested using JEDEC High-K test PCB. Thermal management of the final printed circuit board (PCB) should keep the junction
temperature below +125°C for long term reliability.
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