Datasheet
THS770006
www.ti.com
SBOS520B –JULY 2010–REVISED JANUARY 2012
THERMAL INFORMATION
THS770006
THERMAL METRIC
(1)
RGE UNITS
24 PINS
θ
JA
Junction-to-ambient thermal resistance 44.1
θ
JC(top)
Junction-to-case(top) thermal resistance 35
θ
JB
Junction-to-board thermal resistance 19
°C/W
ψ
JT
Junction-to-top characterization parameter 0.5
ψ
JB
Junction-to-board characterization parameter 18.8
θ
JC(bottom)
Junction-to-case(bottom) thermal resistance 8.9
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
ELECTRICAL CHARACTERISTICS
Test conditions are at T
A
= +25°C, V
S+
= +5V, V
OCM
= +2.5V, V
OUT
= 2V
PP
, R
L
= 400Ω differential, G = +6dB, differential input
and output, and input and output referenced to midsupply, unless otherwise noted. Measured using evaluation module as
discussed in Test Circuits section.
TEST
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT LEVEL
(1)
AC PERFORMANCE
Small-signal bandwidth V
OUT
= 200mV
PP
2.4 GHz C
V
OUT
= 2V
PP
780 MHz C
Large-signal bandwidth
V
OUT
= 3V
PP
485 MHz C
V
OUT
= 2V
PP
360 MHz C
Bandwidth for 0.1dB flatness
V
OUT
= 3V
PP
325 MHz C
V
OUT
= 2V step 3100 V/µs C
Slew rate
V
OUT
= 4V step 3200 V/µs C
Rise time V
OUT
= 2V step 0.6 ns C
Fall time V
OUT
= 2V step 0.6 ns C
Settling time to 0.1% V
OUT
= 2V step 2.2 ns C
Input return loss, s11 See s-Parameters section, f < 200MHz –20 dB C
Output return loss, s22 See s-Parameters section, f < 200MHz –20 dB C
Reverse isolation, s12 See s-Parameters section, f < 200MHz –70 dB C
f = 10MHz –87 dBc C
f = 50MHz –81 dBc C
Second-order harmonic
distortion
f = 100MHz –78 dBc C
f = 200MHz –74 dBc C
f = 10MHz –103 dBc C
f = 50MHz –91 dBc C
Third-order harmonic distortion
f = 100MHz –86 dBc C
f = 200MHz –77 dBc C
f = 50MHz, 10MHz spacing –80 dBc C
f = 100MHz, 10MHz spacing –79 dBc C
Second-order intermodulation
distortion
f = 150MHz, 10MHz spacing –77 dBc C
f = 200MHz, 10MHz spacing –76 dBc C
f = 50MHz, 10MHz spacing –107 dBc C
f = 100MHz, 10MHz spacing –107 dBc C
Third-order intermodulation
distortion
f = 150MHz, 10MHz spacing –97 dBc C
f = 200MHz, 10MHz spacing –82 dBc C
R
L
= 20Ω 19.6 dBm C
1dB compression point f = 100MHz
R
L
= 400Ω 8.7 dBm C
(1) Test levels: (A) 100% tested at +25°C. Over-temperature limits by characterization and simulation. (B) Limits set by characterization and
simulation. (C) Typical value only for information.
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