Datasheet

THS7372
SBOS578 –AUGUST 2011 www.ti.com
ELECTRICAL CHARACTERISTICS: V
S+
= +5 V (continued)
At T
A
= +25°C, R
L
= 150 Ω to GND, and dc-coupled input/output, unless otherwise noted.
THS7372
TEST
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS LEVEL
(1)
OUTPUT CHARACTERISTICS
R
L
= 150 Ω to +2.5 V 4.85 V C
R
L
= 150 Ω to GND 4.4 4.75 V A
High output voltage swing
R
L
= 75 Ω to +2.5V 4.7 V C
R
L
= 75 Ω to GND 4.5 V C
R
L
= 150 Ω to +2.5 V (V
IN
= –0.2 V) 0.06 V C
R
L
= 150 Ω to GND (V
IN
= –0.2 V) 0.05 0.12 V A
Low output voltage swing
R
L
= 75 Ω to +2.5 V (V
IN
= –0.2 V) 0.1 V C
R
L
= 75 Ω to GND (V
IN
= –0.2 V) 0.05 V C
Output current (sourcing) R
L
= 10 Ω to +2.5 V 90 mA C
Output current (sinking) R
L
= 10 Ω to +2.5 V 85 mA C
POWER SUPPLY
Operating voltage 2.6 5 5.5 V B
V
IN
= 0 V, all channels on 19.7 24.5 30.2 mA A
V
IN
= 0 V, SD channel on, FHD channels off 6 7.2 9.5 mA A
Total quiescent current, no load
V
IN
= 0 V, SD channel off, FHD channels on 13.7 17.3 20.7 mA A
V
IN
= 0 V, all channels off, V
DISABLE
= 3 V 1 10 μA A
Power-supply rejection ratio
At dc 52 dB C
(PSRR)
LOGIC CHARACTERISTICS
(2)
V
IH
Disabled 2.1 1.9 V A
V
IL
Enabled 1.2 1 V A
I
IH
Applied voltage = 3.3 V 1 μA C
I
IL
Applied voltage = 0 V 1 μA C
Disable time 150 ns C
Enable time 200 ns C
(2) The logic input pins default to a logic '0' condition when left floating.
THERMAL INFORMATION
THS7372
THERMAL METRIC
(1)
PW UNITS
14 PINS
θ
JA
Junction-to-ambient thermal resistance 134.4
θ
JC (top)
Junction-to-case (top) thermal resistance 52.2
θ
JB
Junction-to-board thermal resistance 64.3
°C/W
ψ
JT
Junction-to-top characterization parameter 7.5
ψ
JB
Junction-to-board characterization parameter 63.7
θ
JC (bottom)
Junction-to-case (bottom) thermal resistance n/a
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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