Datasheet

THS7353
SLOS484B –NOVEMBER 2005–REVISED AUGUST 2012 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
DESCRIPTION (CONTINUED)
As part of the THS7353 flexibility, the 2:1 MUX input can be selected for ac or dc coupled inputs. The ac coupled
modes include a sync-tip clamp option for CVBS/Y'/G'B'R' with sync or a fixed bias for the C'/P'
B
/P'
R
channels.
The dc input options include a dc input or a dc + 250-mV input offset shift to allow for a full sync dynamic range
at the output with 0-V input.
The THS7353 is the perfect choice for all video buffer applications. The 16.2-mA total quiescent current (54 mW
total power) makes it an excellent choice for USB powered or portable video applications. While fully disabled,
the THS7353 consumes less than 1 μA.
PACKAGING/ORDERING INFORMATION
(1)
TRANSPORT MEDIA,
PACKAGED DEVICES PACKAGE TYPE
QUANTITY
THS7353PW Rails, 70
TSSOP-20
THS7353PWR Tape and reel, 2000
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature range (unless otherwise noted).
UNIT
V
SS
Supply voltage, V
S+
to GND 5.5 V
V
I
Input voltage –0.4 V to V
S+
I
O
Output current ±125 mA
Continuous power dissipation See Dissipation Ratings Table
T
J
Maximum junction temperature, any condition
(2)
150°C
T
J
Maximum junction temperature, continuous operation, long term reliability
(3)
125°C
T
stg
Storage temperature range –65°C to 150°C
HBM 1500 V
ESD ratings CDM 2000 V
MM 100 V
(1) Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied Exposure to absolute maximum rated conditions for extended periods may degrade device reliability.
(2) The absolute maximum junction temperature under any condition is limited by the constraints of the silicon process.
(3) The absolute maximum junction temperature for continuous operation is limited by the package constraints. Operation above this
temperature may result in reduced reliability and/or lifetime of the device.
DISSIPATION RATINGS
POWER RATING
(1)
θ
JC
θ
JA
(T
J
= 125°C)
PACKAGE
(°C/W) (°C/W)
T
A
= 25°C T
A
= 85°C
TSSOP – 20 (PW) 32.3 83
(2)
1.2 W 0.48 W
(1) Power rating is determined with a junction temperature of 125°C. This is the point where distortion starts to substantially increase and
long-term reliability starts to be reduced. Thermal management of the final PCB should strive to keep the junction temperature at or
below 125°C for best performance and reliability.
(2) This data was taken with the JEDEC High-K test PCB. For the JEDEC low-K test PCB, the θ
JA
is 125.8°C.
2 Copyright © 2005–2012, Texas Instruments Incorporated