Datasheet

THS7347
SLOS531B –MAY 2007– REVISED OCTOBER 2011 www.ti.com
DESCRIPTION, CONTINUED
As part of the THS7347 flexibility, the device input can be selected for ac- or dc-coupled inputs. The ac-coupled
modes include a sync-tip clamp option for CVBS/Y'/G'B'R' with sync or a fixed bias for the C'/P'
B
/P'
R
/R'G'B'
channels without sync. The dc input options include a dc input or a dc+Offset shift to allow for a full sync
dynamic range at the output with 0-V input.
The THS7347 is available in a lead-free, RoHS-compliant TQFP package.
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGING/ORDERING INFORMATION
(1)
PACKAGED DEVICES PACKAGE TYPE TRANSPORT MEDIA, QUANTITY
THS7347IPHP Tray, 250
HTQFP-48 PowerPAD™
THS7347IPHPR Tape and Reel, 1000
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature range (unless otherwise noted).
THS7347 UNIT
V
SS
Supply voltage, GND to V
A
or GND to V
DD
5.5 V
V
I
Input voltage –0.4 to V
A
or V
DD
V
I
O
Continuous output current ±80 mA
Continuous power dissipation See Dissipation Rating Table
T
J
Maximum junction temperature, any condition
(2)
+150 °C
T
J
Maximum junction temperature, continuous operation, long term reliability
(3)
+125 °C
T
stg
Storage temperature range –65 to +150 °C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 300 °C
HBM 1500 V
ESD ratings CDM 1500 V
MM 100 V
(1) Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied Exposure to absolute maximum rated conditions for extended periods may degrade device reliability.
(2) The absolute maximum junction temperature under any condition is limited by the constraints of the silicon process.
(3) The absolute maximum junction temperature for continuous operation is limited by the package constraints. Operation above this
temperature may result in reduced reliability and/or lifetime of the device.
DISSIPATION RATINGS
POWER RATING
(1) (2)
(T
J
= +125°C)
θ
JC
θ
JA
PACKAGE (°C/W) (°C/W) T
A
= +25°C T
A
= +85°C
HTQFP-48 with PowerPAD (PHP) 1.2 35 2.85 W 1.14 W
(1) This data was taken with a PowerPAD standard 3-inch by 3-inch, 4-layer printed circuit board (PCB) with internal ground plane
connections to the PowerPAD.
(2) Power rating is determined with a junction temperature of +125°C. This temperature is the point where distortion starts to substantially
increase and long-term reliability starts to be reduced. Thermal management of the final PCB should strive to keep the junction
temperature at or below +125°C for best performance and reliability.
2 Copyright © 2007–2011, Texas Instruments Incorporated