Datasheet

PRINTED WIRING BOARD (PWB) DESIGN GUIDE
CopperTrace
Width
SolderMaskThickness
SolderPadWidth
SolderMaskOpening
CopperTraceThickness
THS7319
www.ti.com .............................................................................................................................................................. SBOS468A – JUNE 2009 – REVISED JULY 2009
the solder mask opening is made larger than the
When designing the pad size for the MicrostarCSP, it
desired land area, and the opening size is defined by
is recommended that the layout use a non-solder
the copper pad width. Figure 53 and Table 2 define
mask defined (NSMD) landing pad. With this method,
the land pattern recommendations. Figure 54 and
Table 3 show a trace width example.
Figure 53. Land Pattern Recommendations
Table 2. Definitions for Figure 53
SOLDER MASK
SOLDER PAD COPPER PAD OPENING STENCIL OPENING STENCIL THICKNESS
Non-solder mask defined 250 µ m × 250 µ m square
200 µ m to 275 µ m Copper pad + 50 µ m 100 µ m
(NSMD) (rounded corners)
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