Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsLinear ICsLinear IC - Amplifier - Video buffering Rail-to-rail 8.5 MHz SOIC 8

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FEATURES DESCRIPTION

APPLICATIONS

DAC/

Encoder

(DaVinci )

CVBS

Y’

C’

75 W

Y’

OUT

75 W

C’

OUT

75 W

3.3V

+1.8V

75 W

SDTV

CVBS

S-Video Y’

S-VideoC’

480i/576i

Y’P’ P’

G’B’R’

B R

75 W

S-Video

500 W

S+

GND

CH.2IN

CH.3IN

CH.1IN

CH.3OUT

CH.2OUT

CH.1OUT

THS7315

CVBS

OUT

Gain=

5.2V/V

THS7315

SLOS532 – JUNE 2007

3-Channel SDTV Video Amplifier with 5th-Order Filters and 5.2-V/V Gain

• Three SDTV Video Amplifiers for CVBS,

Fabricated using the revolutionary complementary

S-Video, Y'P'

480i/576i, Y'U'V', or G'B'R'

silicon-sermanium (SiGe) BiCom3 process, the

(R'G'B')

THS7315 is a low-power, single-supply, 3-V to 5-V

3-channel integrated video buffer. It incorporates a

• Integrated Low-Pass Filters:

5th-order Butterworth filter that is useful as a

– 5th-Order, 8.5-MHz (–3dB) Butterworth

digital-to-analog converter (DAC) reconstruction filter

– –1dB Passband Bandwidth at 7 MHz

or an analog-to-digital converter (ADC) anti-aliasing

filter. The 8.5-MHz filter is a perfect choice for SDTV

– 47 dB Attenuation at 27 MHz

video, including Composite Video Baseband Signals

• Versatile Input Biasing:

(CVBS), S-Video, Y’U’V’, G’B’R’ (R’G’B’), and

– DC-Coupled with 230-mV Output Shift

Y’P’

P’

480i/576i.

– AC-Coupled with Sync-Tip Clamp

The THS7315 inputs can be either ac- or dc-coupled.

– Allows AC-Coupled With DC-Biasing

The 230-mV output level shift allows for a full sync

dynamic range at the output with 0 V input. The

• Built-in 5.2 V/V Gain (14.3 dB)

ac-coupled modes include a transparent sync-tip

• +3-V to +5-V Single Supply Operation

clamp option for CVBS, Y', and G'B'R' signals with

• Rail-to-Rail Output:

bottom-level sync. AC-coupled biasing for C'/P'

/P'

channels can easily be achieved by adding an

– Output Swings Within 100 mV of the Rails,

external resistor to V

S+

Allowing AC- or DC-Output Coupling

– Supports Driving Two Lines per Channel

The THS7315 is the perfect choice for all output

buffer applications. Its rail-to-rail output stage with

• Low Total Quiescent Current: 15.6 mA at 3.3 V

5.2-V/V gain allows for both ac and dc line driving,

• Low Differential Gain/Phase of 0.2%/0.3 °

making it a perfect choice for DaVinci™ processors.

• Lead-free, Green SOIC-8 Package

The ability for each channel to drive two video lines,

or 75- Ω loading, allows for maximum flexibility as a

video line driver. The 15.6-mA quiescent current at

3.3 V also makes it an excellent choice for

• Set Top Box Output Video Buffering

USB-powered, portable, or other power-sensitive

• PVR/DVDR Output Buffering

video applications

• USB/Portable Low-Power Video Buffering

The THS7315 is available in a small SOIC-8

package that is lead-free and compliant with green

requirements.

3.3-V Single-Supply DC-Input/DC-Output Coupled Video Line Driver

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

DaVinci is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (28 pages)

PAGE 1
THS7315 www.ti.com SLOS532 – JUNE 2007 3-Channel SDTV Video Amplifier with 5th-Order Filters and 5.2-V/V Gain FEATURES • • • • • • • • • DESCRIPTION Three SDTV Video Amplifiers for CVBS, S-Video, Y'P'BP'R 480i/576i, Y'U'V', or G'B'R' (R'G'B') Integrated Low-Pass Filters: – 5th-Order, 8.
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THS7315 www.ti.com SLOS532 – JUNE 2007 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure.
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THS7315 www.ti.com SLOS532 – JUNE 2007 ELECTRICAL CHARACTERISTICS: VS+ = 3.3 V RL = 150Ω to GND, unless otherwise noted. See Figure 1 and Figure 2. TYP PARAMETER TEST CONDITIONS OVER TEMPERATURE +25°C +25°C 0°C to +70°C –40°C to +85°C UNIT MIN/MAX/ TYP 8.5 6.8/10.4 6.7/10.5 6.6/10.6 MHz Min/Max 8.5 6.8/10.4 6.7/10.5 6.6/10.6 MHz Min/Max AC PERFORMANCE Small-signal bandwidth (–3 dB) VO – 0.2 VPP Large-signal bandwidth (–3 dB) (1) VO – 2 VPP (1) Passband bandwidth (–1dB) 7.
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THS7315 www.ti.com SLOS532 – JUNE 2007 ELECTRICAL CHARACTERISTICS: VS+ = 5 V RL = 150Ω to GND, unless otherwise noted. See Figure 1 and Figure 2. TYP PARAMETER TEST CONDITIONS OVER TEMPERATURE +25°C +25°C 0°C to +70°C –40°C to +85°C UNIT MIN/MAX/ TYP 8.5 6.8/10.4 6.7/10.5 6.6/10.6 MHz Min/Max 8.5 6.8/10.4 6.7/10.5 6.6/10.6 MHz Min/Max AC PERFORMANCE Small-signal bandwidth (–3 dB) VO – 0.
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THS7315 www.ti.com SLOS532 – JUNE 2007 PIN CONFIGURATION SOIC-8 (D) (Top View) THS7315 1 CH.1 IN CH.1 OUT 8 2 CH.2 IN CH.2 OUT 7 3 CH.3 IN CH.3 OUT 6 4 VS+ GND 5 TERMINAL FUNCTIONS TERMINAL NO. (SOIC-8) I/O CH. 1 IN 1 I Video Input, Channel 1 CH. 2 IN 2 I Video Input, Channel 2 CH. 3 IN 3 I Video Input, Channel 3 VS+ 4 I Positive Power Supply Pin. Connect to 3 V to 5 V. GND 5 I Ground pin for all internal circuitry. CH. 3 OUT 6 O Video Output, Channel 3 CH.
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THS7315 www.ti.com SLOS532 – JUNE 2007 FUNCTIONAL BLOCK DIAGRAM +VS gm+ Level Shift - Channel 1 Input LPF Sync-Tip Clamp (DC restore) 800 kW 5.2 V/V Channel 1 Output 5.2 V/V Channel 2 Output 5.2 V/V Channel 3 Output 5-Pole 8.5 MHz +VS + - Level Shift gm Channel 2 Input LPF Sync-Tip Clamp (DC restore) 800 kW 5-Pole 8.5 MHz +VS + - Level Shift gm Channel 3 Input 800 kW LPF Sync-Tip Clamp (DC restore) 5-Pole 8.
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THS7315 www.ti.com SLOS532 – JUNE 2007 APPLICATION INFORMATION The THS7315 is targeted for standard definition (SD) video output buffer applications. Although it can be used for numerous other applications, the needs and requirements of the video signal are the most important design parameters of the THS7315. Built on the revolutionary complementary silicon-germanium (SiGe) BiCom3 process, the THS7315 incorporates many features not typically found in integrated video parts while consuming very low power.
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THS7315 www.ti.com SLOS532 – JUNE 2007 APPLICATION INFORMATION (continued) INPUT OVERVOLTAGE PROTECTION The THS7315 is built using a very high-speed complementary bipolar and CMOS process. The internal junction breakdown voltages are relatively low for these very small geometry devices. These breakdowns are reflected in the Absolute Maximum Ratings table. All input and output device pins are protected with internal ESD protection diodes to the power supplies, as shown in Figure 3.
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THS7315 www.ti.com SLOS532 – JUNE 2007 APPLICATION INFORMATION (continued) Note that the Y' term is used for the luma channels throughout this document rather than the more common luminance (Y) term. The reason for this usage is to account for the definition of luminance as stipulated by the CIE (International Commission on Illumination). Video departs from true luminance because a nonlinear term, gamma, is added to the true RGB signals to form R'G'B' signals.
PAGE 10
THS7315 www.ti.com SLOS532 – JUNE 2007 APPLICATION INFORMATION (continued) The THS7315 input impedance in this operating mode is dictated by the internal 800-kΩ pull-down resistor, as shown in Figure 5. Note that the internal voltage shift does not appear at the input pin, but only at the output pin. Internal Circuitry +VS Input + 800 kW - Internal Level Shifter Figure 5.
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THS7315 www.ti.com SLOS532 – JUNE 2007 APPLICATION INFORMATION (continued) +VS +VS Comparator Internal Circuitry STC LPF + Input Pin - Input + 0.1 m F 800 kW - Internal Level Shifter Figure 6. Equivalent AC Sync-Tip Clamp Input Circuit As a result of the delay, the sync may have an apparent voltage shift. The amount of shift depends on the amount of droop in the signal as dictated by the input capacitor and the STC current flow.
PAGE 12
THS7315 www.ti.com SLOS532 – JUNE 2007 APPLICATION INFORMATION (continued) To allow for both dc-coupling and ac-coupling in the same part, the THS7315 incorporates an 800-kΩ resistor to ground. Although a true constant current sink is preferred over a resistor, there are significant issues when the voltage is near ground. (For example, voltage near ground can cause the current sink transistor to saturate and produce potential signal problems.
PAGE 13
THS7315 www.ti.com SLOS532 – JUNE 2007 APPLICATION INFORMATION (continued) One other issue that must be taken into account is the dc-bias point. The dc-bias point is a function of the power supply. As such, there is as a low-pass filter. Additionally, the time to charge the capacitor to the final dc bias point is also a function of the pull-up resistor and the input capacitor. Lastly, the input capacitor forms a high-pass filter with the parallel impedance of the pull-up resistor and the 800-kΩ resistor.
PAGE 14
THS7315 www.ti.com SLOS532 – JUNE 2007 APPLICATION INFORMATION (continued) OUTPUT MODE OF OPERATION—AC-COUPLED The most common method of coupling the video signal to the line is through the use of a large capacitor. This capacitor is typically between 220 μF and 1000 μF, although 330 μF is very common. The value of this capacitor must be this large to minimize the line tilt (droop) and/or field tilt associated with ac coupling as discussed previously in this document.
PAGE 15
THS7315 www.ti.com SLOS532 – JUNE 2007 APPLICATION INFORMATION (continued) Lastly, because of the edge rates and frequencies of operation, it is recommended (but not required) to place a 0.1-μF to 0.01-μF capacitor in parallel with the large 220-μF to 1000-μF capacitor. These large-value capacitors are generally aluminum electrolytic.
PAGE 16
THS7315 www.ti.com SLOS532 – JUNE 2007 APPLICATION INFORMATION (continued) ADVANTAGES OVER PASSIVE FILTERING Two key benefits of using an integrated filter system such as the THS7315 over a passive system are PCB area and filter variations. For overall board area, the small SOIC-8 package for 3-video channels is much smaller over a passive RLC network, especially a 5-pole passive network.
PAGE 17
THS7315 www.ti.com SLOS532 – JUNE 2007 EVALUATION MODULE To evaluate the THS7315, an evaluation module (EVM) is available. The EVM allows for testing the THS7315 in many different systems. Inputs and outputs include RCA connectors for consumer grade interconnections, or BNC connectors for higher-level lab grade connections. Several unpopulated component pads are found on the EVM to allow for different input and output configurations as dictated by the user. Figure 10 shows the THS7315EVM schematic.
PAGE 18
THS7315 www.ti.com SLOS532 – JUNE 2007 EVALUATION MODULE (continued) Figure 11.
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THS7315 www.ti.com SLOS532 – JUNE 2007 EVALUATION MODULE (continued) Figure 12.
PAGE 20
THS7315 www.ti.com SLOS532 – JUNE 2007 EVALUATION MODULE (continued) THS7315EVM Bill of Materials Table 1. THS7315D EVM ITEM REF DES QTY DESCRIPTION 1 FB1 1 Bead, Ferrite, 2.
PAGE 21
THS7315 www.ti.com SLOS532 – JUNE 2007 EVALUATION BOARD/KIT IMPORTANT NOTICE (continued) The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claims arising from the handling or use of the goods. Due to the open construction of the product, it is the user’s responsibility to take any and all appropriate precautions with regard to electrostatic discharge.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
PAGE 24
PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device THS7315DR Package Package Pins Type Drawing SOIC D 8 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 12.4 Pack Materials-Page 1 6.4 B0 (mm) K0 (mm) P1 (mm) 5.2 2.1 8.0 W Pin1 (mm) Quadrant 12.
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PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) THS7315DR SOIC D 8 2500 367.0 367.0 35.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.