Datasheet

THS6214
www.ti.com ....................................................................................................................................................................................................... SBOS431 – MAY 2009
e) Socketing a high-speed part such as the f) Use the – V
S
plane to conduct heat out of the
THS6214 is not recommended. The additional lead QFN-24 and TSSOP-24 PowerPAD packages. These
length and pin-to-pin capacitance introduced by the packages attach the die directly to an exposed
socket can create an extremely troublesome parasitic thermal pad on the bottom, which should be soldered
network, which can make it almost impossible to to the board. This pad must be connected electrically
achieve a smooth, stable frequency response. Best to the same voltage plane as the most negative
results are obtained by soldering the THS6214 supply applied to the THS6214 (in Figure 82 , this
directly onto the board. supply is – 12V).
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