Datasheet

1,3
6,6
3
3,7
4,4
6,5
0,65
1,3
PadSize
20x(0,3x1,6)mm
Note: Alllineardimensionsareinmillimeters.
PowerPADandViaLayout
(PadSize3mmx3,7mm.9ViaswithDiameter=0,3mm)
ViasshouldgothroughtheboardconnectingthetopPowerPADtoanyandall
groundplanes. Thelargerthegroundplane,themoreareatodistributetheheat.
Solderresistshouldbeusedonthebottomsidegroundplanetopreventwickingof
thesolderthroughtheviasduringtheprocess.
THS6184
SLLS635D – AUGUST 2005 – REVISED JANUARY 2009 ................................................................................................................................................. www.ti.com
Figure 59. Suggested PCB Layout For 20-Pin PWP Package
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