Datasheet

2,2987
0,3721
0,4953
0,1905
0,1905
0,4953
0,3641
4,9022
3,302
5,9182
0,563
0,682
Note: Alllineardimensionsareinmillimeters.
1,143
2,65
3,65
0,762
PowerPADandViaLayout
(PadSize3,65mmx2,65mm.9ViaswithDiameter=0,254mm)
ViasshouldgothroughtheboardconnectingthetopPowerPADtoanyandall
groundplanes. Thelargerthegroundplane,themoreareatodistributetheheat.
Solderresistshouldbeusedonthebottomsidegroundplanetopreventwickingof
thesolderthroughtheviasduringtheprocess.
PadSize
24x(0,3048x0,762)mm
THS6184
www.ti.com ................................................................................................................................................. SLLS635D – AUGUST 2005 – REVISED JANUARY 2009
Figure 58. Suggested PCB Layout For 24-Pin RHF Package
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Product Folder Link(s): THS6184