Datasheet

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+
−
THS6182a
+18 V
+
−
1:1.6
+18 V
4.87
Ω
100
Ω
750
Ω
750
Ω
CODEC
V
IN−
CODEC
V
IN+
4.87
Ω
20-dBm
Line
Power
THS6182b
1.33 kW
1 kW
1 kW
R
G
R
G
R
F
PIN ASSIGNMENTS
20
19
18
17
16
15
14
13
12
11
D1 IN−
D1 OUT
V −
GND
GND
GND
GND
D1 IN+
BIAS−2
BIAS−1
D2 IN−
D2 OUT
GND
GND
GND
GND
D2 IN+
I
ADJ
N/C
1
2
3
4
5
6
7
8
9
10
THS6182
SOIC−20 (DW) AND
SOIC−20 PowerPAD (DWP) PACKAGES
(TOP VIEW)
16
15
14
13
12
11
10
9
D1 IN−
D1 OUT
V
CC
−
GND
GND
D1 IN+
BIAS−2
BIAS−1
D2 IN−
D2 OUT
V
CC
+
GND
GND
D2 IN+
I
ADJ
N/C
1
2
3
4
5
6
7
8
THS6182
SOIC−16 (D) PACKAGE
(TOP VIEW)
D1 IN−
N/C
V
CC−
N/C
N/C
N/C
N/C
GND
D2 IN−
N/C
V
CC+
N/C
N/C
N/C
N/C
GND
D2 OUT
N/C
D1 OUT
Power
PAD
TM
THS6182
Leadless 24−pin PowerPAD
4 mm X 5 mm (RHF) PACKAGE
(TOP VIEW)
BIAS−2
BIAS−1
D1IN+
I
ADJ
D2IN+
V
CC
+
CC
1
2
3
4
5
6
7
19
18
17
16
15
14
13
8 9 10 11 12
24 23 22 21 20
THS6182
SLLS544H – SEPTEMBER 2002 – REVISED JUNE 2007
Figure 1. Single-Supply ADSL CO Line Driver Circuit Utilizing Active Impedance (SF = 4)
A. The PowerPAD is electrically isolated from all active circuity and pins. Connection of the PowerPAD to the PCB
ground plane is highly recommended, although not required, as this plane is typically the largest copper plane on a
PCB. The thermal performance will be better with a large copper plane than a small one.
6
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