Datasheet

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PACKAGE DISSIPATION RATINGS
(1)
RECOMMENDED OPERATING CONDITIONS
THS6182
SLLS544H SEPTEMBER 2002 REVISED JUNE 2007
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
PRODUCT PACKAGE
(1)
PACKAGE CODE SYMBOL ORDER NUMBER TRANSPORT MEDIA
Tape and reel
THS6182RHFR
(3000 devices)
Leadless 24-pin
THS6182RHF RHF-24 6182
4, mm x 5, mm PowerPAD™
Tape and reel
THS6182RHFT
(250 devices)
THS6182D Tube (40 devices)
THS6182D SOIC-16 D-16 THS6182
Tape and reel
THS6832DR
(2500 devices)
THS6182DW Tube (25 devices)
THS6182DW SOIC-20 DW-20 THS6182
Tape and reel
THS6182DWR
(2000 devices)
THS6182DWP Tube (25 devices)
THS6182DWP SOIC-20 PowerPAD DWP-20 THS6182
Tape and reel
THS6182DWPR
(2000 devices)
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com .
PowerPAD SOLDERED
(2)
PowerPAD NOT SOLDERED
(3)
PACKAGE θ
JC
θ
JA
θ
JC
RHF-24
(2)
32 ° C/W 74 ° C/W 1.7 ° C/W
D-16 -- 62.9 ° C/W 25.7 ° C/W
DW-20 -- 45.4 ° C/W 16.4 ° C/W
DWP-20
(2)
21.5 ° C/W 43.9 ° C/W 0.37 ° C/W
(1) θ
JA
values shown are typical for standard test PCBs only.
(2) For high-power dissipation applications, use of the PowerPAD package with the PowerPad on the underside of the chip. This acts as a
heatsink and must be connected to a thermally dissipating plane for proper dissipation. Failure to do so may result in exceeding the
maximum junction temperature which could permanently damage and/or reduce the lifetime the device. See TI technical brief SLMA002
for more information about utilizing the PowerPAD thermally enhanced package.
(3) Use of packages without the PowerPAD or not soldering the PowerPAD to the PCB, should be limited to low-power dissipation
applications.
MIN NOM MAX UNIT
Dual supply ± 5 ± 12 ± 15
V
CC+
to V
CC-
Supply voltage V
Single supply 10 24 30
2
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