Datasheet

 
  ±     
SLOS264G − MARCH 2000 − REVISED DECEMBER 2001
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
AVAILABLE OPTIONS
PACKAGED DEVICE
EVALUATION
T
A
SOIC-8
(D)
SOIC-8 PowerPAD
(DDA)
SOIC-14
(D)
TSSOP-14
(PWP)
EVALUATION
MODULES
0°C to 70°C THS6042CD THS6042CDDA THS6043CD THS6043CPWP
THS6042EVM
THS6043EVM
−40°C to 85°C THS6042ID THS6042IDDA THS6043ID THS6043IPWP —
absolute maximum ratings over operating free-air temperature (unless otherwise noted)
†
Supply voltage, V
CC+
to V
CC−
33 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage ± V
CC
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output current (see Note 1) 450 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Differential input voltage ± 4 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum junction temperature 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Total power dissipation at (or below) 25°C free-air temperature See Dissipation Ratings Table. . . . . . . . . . .
Operating free-air temperature, T
A
: Commercial 0°C to 70°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Industrial −40°C to 85°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature, T
stg
: Commercial −65°C to 125°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Industrial −65°C to 125°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 300°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The THS6042 and THS6043 may incorporate a PowerPAD on the underside of the chip. This acts as a heatsink and must be connected
to a thermally dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature
which could permanently damage the device. See TI Technical Brief SLMA002 for more information about utilizing the PowerPAD
thermally enhanced package.
DISSIPATION RATING TABLE
PACKAGE
θ
JA
θ
JC
T
A
= 25°C
T
J
= 150°C
POWER RATING
D-8 95°C/W
‡
38.3°C/W
‡
1.32 W
DDA 45.8°C/W
‡
9.2°C/W
‡
2.73 W
D-14 66.6°C/W
‡
26.9°C/W
‡
1.88 W
PWP 37.5°C/W 1.4°C/W 3.3 W
‡
This data was taken using the JEDEC proposed high-K test PCB. For the JEDEC low-K test
PCB, the Θ
JA
is168°C/W for the D−8 package and 122.3°C/W for the D−14 package.