Datasheet

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T
A
− Free-Air Temperature − °C
0
1
2
3
4
5
6
−40 −20 0 20 40 60 80 100
Maximum Power Dissipation − W
G052
T
J
= 150°C
PCB Size = 3” x 3”
No Air Flow
θ
JA
= 37.5°C/W
2 oz Trace and
Copper Pad
with Solder
θ
JA
= 97.7°C/W
2 oz Trace and Copper Pad
without Solder
THS6022
SLOS225D – SEPTEMBER 1998 – REVISED JULY 2007
More-complete details of the thermal pad installation process and thermal management techniques can be found
in the PowerPAD Thermally Enhanced Package application report (SLMA002 ).
MAXIMUM POWER DISSIPATION
vs
FREE-AIR TEMPERATURE
Figure 59.
30
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