Datasheet

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DESCRIPTION (CONTINUED)
THS6022
SLOS225D – SEPTEMBER 1998 – REVISED JULY 2007
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
The THS6022 is packaged in the patented PowerPAD™ package. This package provides outstanding thermal
characteristics in a small-footprint package that is fully compatible with automated surface-mount assembly
procedures. The exposed thermal pad on the underside of the package is in direct contact with the die. By
simply soldering the pad to the PWB copper and using other thermal outlets, the heat is conducted away from
the junction.
AVAILABLE OPTIONS
PACKAGED DEVICE
T
A
PowerPAD™ PLASTIC MicroStar Junior™
EVALUATION MODULE
SMALL OUTLINE
(1)
(PWP) (GQE)
0 ° C to 70 ° C THS6022CPWP THS6022CGQE THS6022EVM
–40 ° C to 85 ° C THS6022IPWP THS6022IGQE –
(1) The PWP packages are available taped and reeled. Add an R suffix to the device type (e.g.,
THS6022CPWPR)
TERMINAL FUNCTIONS
TERMINAL
PWP PACKAGE GQE PACKAGE
NAME
TERMINAL NO. TERMINAL NO.
1OUT 2 A3
1IN– 5 F1
1IN+ 4 D1
2OUT 13 A7
2IN– 10 F9
2IN+ 11 D9
V
CC+
3, 12 B1, B9
V
CC–
1, 14 A4, A6
NC 6, 7, 8, 9 NA
3
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