Datasheet

_
+
Driver 1
Driver 2
_
+
3
4
5
17
16
2
1
18
19
20
V
CC
+
V
CC+
V
CC–
V
CC–
1OUT
2OUT
1IN+
1IN–
2IN+
2IN–
THS6012
SLOS226F –SEPTEMBER 1998–REVISED JUNE 2012 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Table 1. AVAILABLE OPTIONS
PACKAGED DEVICE
PowerPAD PLASTIC
T
A
MicroStar Junior EVALUATION
SMALL OUTLINE
(1)
(GQE) MODULE
(DWP)
0°C to 70°C THS6012CDWP THS6012CGQE THS6012EVM
-40°C to 85°C THS6012IDWP THS6012IGQE —
(1) The PWP packages are available taped and reeled. Add an R suffix to the device type (i.e.,
THS6012CPWPR)
FUNCTIONAL BLOCK DIAGRAM
2 Copyright © 1998–2012, Texas Instruments Incorporated