Datasheet

THS4631
www.ti.com SLOS451B –DECEMBER 2004– REVISED AUGUST 2011
Results are with no air flow and PCB size = 3" x 3 "
θ
JA
= 58.4°C/W for the 8-pin MSOP with
PowerPAD (DGN).
θ
JA
= 98°C/W for the 8-pin SOIC high-K test PCB
(D).
θ
JA
= 158°C/W for the 8-pin MSOP with
PowerPAD, without solder.
When determining whether or not the device satisfies
the maximum power dissipation requirement, it is
important to not only consider quiescent power
dissipation, but also dynamic power dissipation. Often
times, this is difficult to quantify because the signal
pattern is inconsistent, but an estimate of the RMS
power dissipation can provide visibility into a possible
problem
DESIGN TOOLS EVALUATION FIXTURE,
SPICE MODELS, AND APPLICATIONS
SUPPORT
Texas Instruments is committed to providing its
customers with the highest quality of applications
support. To support this goal an evaluation board has
been developed for the THS4631 operational
Figure 48. EVM Layers 2 and 3, Ground
amplifier. The board is easy to use, allowing for
straightforward evaluation of the device. The
evaluation board can be ordered through the Texas
Instruments web site, www.ti.com, or through your
local Texas Instruments sales representative. The
board layers are provided in Figure 47, Figure 48,
and Figure 49. The bill of materials for the evaluation
board is provided in Table 2.
Figure 49. EVM Bottom Layer
Figure 47. EVM Top Layer
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