Datasheet

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ABSOLUTE MAXIMUM RATINGS
DISSIPATION RATINGS TABLE PER PACKAGE
THS4520
SLOS503B – SEPTEMBER 2006 – REVISED JULY 2007
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
over operating free-air temperature range (unless otherwise noted)
UNIT
V
S–
to V
S+
Supply voltage 6 V
V
I
Input voltage ± V
S
V
ID
Differential input voltage 4 V
I
O
Output current
(1)
200 mA
Continuous power dissipation See Dissipation Rating Table
Maximum junction temperature 150 ° C
T
J
Maximum junction temperature, continuous operation, long term reliability 125 ° C
T
A
Operating free-air temperature range –40 ° C to 85 ° C
T
stg
Storage temperature range –65 ° C to 150 ° C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 300 ° C
HBM 2000
ESD ratings CDM 1500
MM 100
(1) The THS4520 incorporates a (QFN) exposed thermal pad on the underside of the chip. See TI technical brief SLMA002 and SLMA004
for more information about utilizing the QFN thermally enhanced package.
POWER RATING
PACKAGE
(1)
θ
JC
θ
JA
T
A
≤ 25 ° C T
A
= 85 ° C
RGT (16) 2.4 ° C/W 39.5 ° C/W 2.3 W 225 mW
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com .
2
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