Datasheet

THS4281
SLOS432A –APRIL 2004–REVISED NOVEMBER 2009 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature range (unless otherwise noted).
UNIT
Supply voltage, V
S–
to V
S+
16.5 V
Input voltage, V
I
±V
S
± 0.5 V
Differential input voltage, V
ID
±2 V
Output current, I
O
±100 mA
Continuous power dissipation See Dissipation Ratings Table
Maximum junction temperature, any condition,
(2)
T
J
+150°C
Maximum junction temperature, continuous operation, long-term reliability
(2)
T
J
+125°C
Storage temperature range, T
stg
–65°C to +150°C
HBM 3500 V
ESD ratings CDM 1500 V
MM 100 V
(1) The absolute maximum ratings under any condition is limited by the constraints of the silicon process. Stresses above these ratings may
cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied.
(2) The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may
result in reduced reliability and/or lifetime of the device. recommended operating conditions.
RECOMMENDED OPERATING CONDITIONS
MIN MAX UNIT
Dual supply ±1.35 ±8.25
Supply voltage, (V
S+
and V
S –
) V
Single supply 2.7 16.5
DISSIPATION RATINGS TABLE PER PACKAGE
θ
JA
(1)
POWER RATING
(2)
θ
JC
PACKAGE
(°C/W)
(°C/W)
T
A
< +25°C T
A
= +85°C
DBV (5) 55 255.4 391 mW 156 mW
D (8) 38.3 97.5 1.02 W 410 mW
DGK (8) 71.5 180.8 553 mW 221 mW
(1) This data was taken using the JEDEC standard High-K test PCB.
(2) Power rating is determined with a junction temperature of +125°C. This is the point where distortion starts to substantially increase.
Thermal management of the final PCB should strive to keep the junction temperature at or below +125°C for best performance and long
term reliability.
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