Datasheet

General PowerPADE Design Considerations
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General
Correct PCB layout and manufacturing techniques are critical for achieving
adequate transfer of heat away from the PowerPAD IC package. More
details on proper board layout can be found in the THS4081, THS4082
175-MHz Low-Power High-Speed Amplifiers
data sheet (literature number
SLOS274). For more general information on the PowerPAD package and its
thermal characteristics, see the Texas Instruments Technical Brief,
PowerPAD  Thermally Enhanced Package (literature number SLMA002) and
the
PowerPad  Made Easy application brief (literature number SLMA004).