Datasheet

Description
1-3
General
1.2 Description
The TI THS4062 dual high-speed amplifier evaluation module (EVM) is a
complete dual high-speed amplifier circuit. It consists of the TI THS4062 dual
high-speed amplifier IC, along with a small number of passive parts, mounted
on a small circuit board measuring approximately 1.9 inch by 2.2 inch (Figure
1–1). The EVM uses standard SMA miniature RF connectors for inputs and
outputs and is completely assembled, tested, and ready to use — just connect
it to power, a signal source, and a load (if desired).
Figure 1–1. THS4062 Evaluation Module
+
+VCC
C1
C2
–VCC
U1
J2
GND
R1
J3
Vout1
SLOP235
THS4062 EVM Board
INSTRUMENTS
+
TEXAS
R2 R3 R4 R5 R6 C3 R7
C5
C4
R8
R9 R10 R11 R12 R13 R14 C6 R15
J5
Vout2
J1
Vin1
J4
Vin2
Note: The EVM is shipped with the following component locations empty:
C3, C6, R2, R4, R8, R10, R12
Although the THS4062 EVM is shipped with components installed for
dual-channel single-ended noninverting operation, it can also be configured
for single-channel differential and/or inverting operation by moving
components. Noninverting gain is set to 2 with the installed components. The
input of each channel is terminated with a 50-Ω impedance to provide correct
line impedance matching. The amplifier IC outputs are routed through 50-Ω
resistors both to provide correct line impedance matching and to help isolate
capacitive loading on the outputs of the amplifier. Capacitive loading directly
on the output of the IC decreases the amplifier’s phase margin and can result
in peaking or oscillations.