Datasheet

Running Title—Attribute Reference
vi
Figures
1–1 THS4062 Evaluation Module 1-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1–2 THS4062 EVM Schematic — Noninverting Operation 1-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1–3 THS4062 EVM Schematic — Inverting Operation 1-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1–4 THS4062 EVM Schematic — Differential Input (Noninverting Operation) 1-11. . . . . . . . . . . .
1–5 THS4062 EVM Schematic — Differential Input (Inverting Operation) 1-13. . . . . . . . . . . . . . . .
1–6 THS4062 EVM Frequency Response at V
CC
= ± 5 V and Gain = 2 1-16. . . . . . . . . . . . . . . . .
1–7 THS4062 EVM Phase vs. Frequency at V
CC
= ± 15 V and Gain = 2 1-16. . . . . . . . . . . . . . . .
1–8 PowerPAD PCB Etch and Via Pattern 1-18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1–9 Maximum Power Dissipation vs. Free-Air Temperature 1-19. . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–1 THS4062 EVM Complete Schematic 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–2 THS4062 EVM Component Placement Silkscreen and Solder Pads 2-4. . . . . . . . . . . . . . . . .
2–2 THS4062 EVM PC Board Layout – Component Side 2-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–3 THS4062 EVM PC Board Layout – Back Side 2-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Tables
2–1 THS4062 EVM Parts List 2-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .