Datasheet

 
  
SLOS234E − DECEMBER 1998 − REVISED DECEMBER 2003
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
RELATED DEVICES
DEVICE DESCRIPTION
THS4011/2
THS4031/2
THS4061/2
290-MHz Low Distortion High-Speed Amplifiers
100-MHz Low Noise High Speed-Amplifiers
180-MHz High-Speed Amplifiers
AVAILABLE OPTIONS
PACKAGED DEVICES
T
A
NUMBER OF
CHANNELS
PLASTIC
SMALL
OUTLINE
(D)
PLASTIC
MSOP
(DGN)
CERAMIC
DIP
(JG)
CHIP
CARRIER
(FK)
MSOP
SYMBOL
EVALUATION
MODULES
0
°
C to
1 THS4061CD THS4061CDGN TIABS THS4061EVM
0 C to
70°C
2 THS4062CD THS4062CDGN TIABM THS4062EVM
−40
°
C to
1 THS4061ID THS4061IDGN TIABT
−40 C to
85°C
2 THS4062ID THS4062IDGN TIABN
−55°C to
125°C
1 THS4061MJG THS4061MFK
The D and DGN packages are available taped and reeled. Add an R suffix to the device type (i.e., THS4061CDGNR).
functional block diagram
OUT
8
6
1
IN−
IN+
2
3
Null
+
Figure 1. THS4061 − Single Channel
1OUT
1IN−
1IN+
V
CC
2OUT
2IN−
2IN+
−V
CC
8
6
1
2
3
5
7
4
+
+
Figure 2. THS4062 − Dual Channel