Datasheet



SLOS238D − MAY 1999 − REVISED AUGUST 2008
www.ti.com
3
AVAILABLE OPTIONS
(1)
PACKAGED DEVICES
T
A
NUMBER
OF
CHANNELS
PLASTIC
SMALL
OUTLINE
†
PLASTIC MSOP
†
(DGN)
CERAMIC DIP
(JG)
CHIP
CARRIER
EVALUATION
MODULE
CHANNELS
OUTLINE
†
(D)
DEVICE
SYMBOL
(JG)
CARRIER
(FK)
MODULE
0°C to 70°C
1 THS4051CD THS4051CDGN ACQ — — THS4051EVM
0
°
C to 70
°
C
2 THS4052CD THS4052CDGN
‡
ACE — — THS4052EVM
−40°C to 85°C
1 THS4051ID THS4051IDGN ACR — — —
−40
°
C to 85
°
C
2 THS4052ID THS4052IDGN
‡
ACF — — —
−55°C to 125°C 1 — — — THS4051MJG THS4051MFK —
(1)
For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site
at www.ti.com.
†
The D and DGN packages are available taped and reeled. Add an R suffix to the device type (i.e., THS4051CDGN).
‡
This device is in the Product Preview stage of development. Please contact your local TI sales office for availability.
FUNCTIONAL BLOCK DIAGRAM
OUT
8
6
1
IN−
IN+
2
3
Null
Figure 1. THS4051 − Single Channel
1OUT
1IN−
1IN+
V
CC
2OUT
2IN−
2IN+
−V
CC
Figure 2. THS4052 − Dual Channel
−100
−90
−80
−70
−60
−50
−40
T OT AL HARMONIC DISTORTION
vs
FREQUENCY
f - Frequency - Hz
20M10M100k 1M
THD - Total Harmonic Distortion - dBc
V
CC
= ± 15 V
Gain = 2
V
O(PP)
= 2 V
R
L
= 150 Ω
R
L
= 1 kΩ