Datasheet

PACKAGE OPTION ADDENDUM
www.ti.com
21-Mar-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
(4)
Samples
THS4041CD ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 4041C
THS4041CDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 4041C
THS4041CDGNR ACTIVE MSOP-
PowerPAD
DGN 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 ACO
THS4041CDGNRG4 ACTIVE MSOP-
PowerPAD
DGN 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 ACO
THS4041CDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 4041C
THS4041CDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 4041C
THS4041ID ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 4041I
THS4041IDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 4041I
THS4041IDGN OBSOLETE MSOP-
PowerPAD
DGN 8 TBD Call TI Call TI -40 to 85 ACP
THS4041IDGNG4 OBSOLETE MSOP-
PowerPAD
DGN 8 TBD Call TI Call TI -40 to 85
THS4041IDGNR ACTIVE MSOP-
PowerPAD
DGN 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 ACP
THS4041IDGNRG4 ACTIVE MSOP-
PowerPAD
DGN 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 ACP
THS4042CD ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 4042C
THS4042CDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 4042C
THS4042CDGN ACTIVE MSOP-
PowerPAD
DGN 8 80 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM ACC
THS4042CDGNG4 ACTIVE MSOP-
PowerPAD
DGN 8 80 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM ACC
THS4042CDGNR ACTIVE MSOP-
PowerPAD
DGN 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM ACC