Datasheet

10
100
1000
0 3 6
9
12 15
|V |-RMSOutputVoltage-V
out
|I |-MaximumRMSOutputCurrent-mA
out
MAXIMUMRMSOUTPUTCURRENT
vs
RMSOUTPUTVOLTAGEDUETOTHERMAL LIMITS
T =130°C
T =50°C
J
A
DGNPackage
=58.4°C/Wq
JA
MaximumOutput
CurrentLimitLine
V =±15V
CC
SO-8Package
=167°C/W
Low-KTestPCB
q
JA
SO-8Package
=98°C/W
High-KTestPCB
q
JA
MAXIMUMRMSOUTPUTCURRENT
RMSOUTPUTVOLTAGEDUETOTHERMAL LIMITS
vs
0
20
40
60
80
100
120
140
160
180
200
0 1 2 3 4 5
V =±5V
T =130°C
T =50°C
CC
J
A
SO-8
=121°C/W
High-KTestPCB
q
JA
PackageWith
<=120°C/Wq
JA
SO-8
=167°C/W
Low-KTestPCB
q
JA
|V |-RMSOutputVoltage-V
out
|I |MaximumRMSOutputCurrent-mA
out
MaximumOutput
CurrentLimitLine
1
10
100
1000
0 3 6 9 12 15
|I |-MaximumRMSOutputCurrent-mA
out
|V |-RMSOutputVoltage-V
out
BothChannels
T =130°C
T =50°C
J
A
MaximumOutput
CurrentLimitsLine
THS4032
V =±15V
CC
DGNPackage
=58.4°C/Wq
JA
SO-8Package
=167°C/W
Low-KTestPCB
q
JA
SO-8Package
=98°C/W
High-KTestPCB
q
JA
Safe
Operating
Area
MAXIMUMRMSOUTPUTCURRENT
vs
RMSOUTPUTVOLTAGEDUETOTHERMAL LIMITS
0
20
40
60
80
100
120
140
160
180
200
0 1 2 3 4 5
|V |-RMSOutputVoltage-V
out
|I |-MaximumRMSOutputCurrent-mA
out
PackageWith
<=60°C/Wq
JA
MaximumOutput
CurrentLimitLine
DGNPackage
=58.4°C/Wq
JA
THS4032
V =±5V
CC
Safe
Operating
Area
SO-8Package
=167°C/W
Low-KTestPCB
q
JA
SO-8Package
=98°C/W
High-KTestPCB
q
JA
BothChannels
T =130°C
T =50°C
J
A
MAXIMUMRMSOUTPUTCURRENT
vs
RMSOUTPUTVOLTAGEDUETOTHERMAL LIMITS
THS4031
THS4032
www.ti.com SLOS224G –JULY 1999–REVISED MARCH 2010
always be soldered to a copper plane to fully use the heat dissipation properties of the PowerPAD™. The SOIC
package, on the other hand, is highly dependent on how it is mounted on the PCB. As more trace and copper
area is placed around the device, q
JA
decreases and the heat dissipation capability increases. The currents and
voltages shown in these graphs are for the total package. For the dual amplifier package (THS4032), the sum of
the RMS output currents and voltages should be used to choose the proper package.
Figure 63. Figure 64.
Figure 65. Figure 66.
Copyright © 1999–2010, Texas Instruments Incorporated Submit Documentation Feedback 31
Product Folder Link(s): THS4031 THS4032