Datasheet
OUT
8
6
1
IN−
IN+
2
3
Null
−
+
1OUT
1IN−
1IN+
V
CC
2OUT
2IN−
2IN+
−V
CC
8
6
1
2
3
5
7
4
−
+
−
+
THS4031
THS4032
www.ti.com
SLOS224G –JULY 1999–REVISED MARCH 2010
FUNCTIONAL BLOCK DIAGRAMS
Figure 1. THS4031 – Single Channel Figure 2. THS4032 – Dual Channel
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature range (unless otherwise noted).
VALUE UNIT
V
CC
Supply voltage, V
CC+
to V
CC–
33 V
V
I
Input voltage ±V
CC
I
O
Output current 150 mA
V
IO
Differential input voltage ±4 V
Continuous total power dissipation See Dissipation Ratings Table
C-suffix 0 to 70
Operating free-air
T
A
I-suffix –40 to 85 °C
temperature
M-suffix –55 to 125
T
J
Maximum junction temperature, (any condition) 150 °C
Maximum junction temperature, continuous operation, long term reliability
(2)
130 °C
T
stg
Storage temperature –65 to 150 °C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 300 °C
Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds, JG package 300 °C
Case temperature for 60 seconds, FK package 260 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may
result in reduced reliability and/or lifetime of the device. Does not apply to the JG package or FK package.
DISSIPATION RATINGS TABLE
q
JA
q
JC
T
A
= 25°C,
PACKAGE
(°C/W) (°C/W) POWER RATING
D 167
(1)
38.3 629 mW, T
J
= 130°C, continuous
DGN
(2)
58.4 4.7 1.8 W, T
J
= 130°C, continuous
JG 119 28 1050 mW, T
J
= 150°C, continuous
FK 87.7 20 1375 mW, T
J
= 150°C, continuous
(1) This data was taken using the JEDEC standard Low-K test PCB. For the JEDEC Proposed High-K test PCB, the q
JA
is 95°C/W with a
power rating at T
A
= 25°C of 1.32 W.
(2) This data was taken using 2 oz. trace and copper pad that is soldered directly to a 3-in. × 3-in. PC. For further information, refer to
Application Information section of this data sheet.
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