Datasheet

T
J
− Junction Temperature − °C
Time-to-Fail − Hrs
80°C, 74M Hrs
100°C, 5.9M Hrs
120°C, 490K Hrs
140°C, 58K Hrs
10K
1M
1G
100K
10M
100M
10080 90 110 120 130 140 150
DISSIPATION RATINGS
RECOMMENDED OPERATING CONDITIONS
THS3201-EP
www.ti.com ..................................................................................................................................................... SGLS283B – APRIL 2005 – REVISED JANUARY 2009
Figure 1. EME-G600 Estimated Wirebond Life
0
JC
0
JA
(1)
PACKAGE
( ° C/W) ( ° C/W)
D (8) 38.3 97.5
DGN (8)
(2)
4.7 58.4
(1) This data was taken using the JEDEC standard High-K test PCB.
(2) The THS3201 may incorporate a thermal pad on the underside of the chip. This acts as a heat sink and must be connected to a
thermally dissipative plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature;
which could permanently damage the device. See Texas Instruments technical briefs SLMA002 and SLMA004 for more information
about utilizing the PowerPAD thermally enhanced package.
MIN MAX UNIT
Dual supply ± 3.3 ± 7.5
Supply voltage V
Single supply 6.6 15
T
A
Operating free air temperature – 55 125 ° C
PACKAGE/ORDERING INFORMATION
PART NUMBER PACKAGE TYPE PACKAGE MARKING TRANSPORT MEDIA, QUANTITY
THS3201MDEP
(1)
Rails, 75
SOIC-8 —
THS3201MDREP
(1)
Tape and reel, 2500
THS3201MDGNEP
(1)
Rails, 80
MSOP-8-PP BLM
THS3201MDGNREP Tape and reel, 2500
(1) Product Preview
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Product Folder Link(s): THS3201-EP