Datasheet
1
2
3
4
8
7
6
5
NC
V
IN-
V
IN+
V
S-
NC
V
S+
V
OUT
NC
D,DGNTOP VIEWD,DGNTOP VIEW
NC =NoInternalConnection
1
2
3
4
8
7
6
5
REF
V
IN-
V
IN+
V
S-
PD
V
S+
V
OUT
NC
NC=NoInternalConnection
THS3120 THS3121
THS3120
THS3121
SLOS420E –SEPTEMBER 2003–REVISED OCTOBER 2009........................................................................................................................................
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
NOTE: The device with the power down option defaults to the ON state if no signal is applied to the PD pin. Additionally, the
REF pin functional range is from V
S–
to (V
S+
– 4 V).
AVAILABLE OPTIONS
(1)
PACKAGED DEVICE
T
A
PLASTIC SMALL OUTLINE SOIC (D) PLASTIC MSOP (DGN)
(2) (3)
SYMBOL
THS3120CD THS3120CDGN
0°C to +70°C AQA
THS3120CDR THS3120CDGNR
THS3120ID THS3120IDGN
–40°C to +85°C APN
THS3120IDR THS3120IDGNR
THS3121CD THS3121CDGN
0°C to +70°C AQO
THS3121CDR THS3121CDGNR
THS3121ID THS3121IDGN
–40°C to +85°C APO
THS3121IDR THS3121IDGNR
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Available in tape and reel. The R suffix standard quantity is 2500 (for example, THS3120CDGNR).
(3) The PowerPAD is electrically isolated from all other pins.
DISSIPATION RATING TABLE
POWER RATING
T
J
= +125°C
PACKAGE θ
JC
(°C/W) θ
JA
(°C/W) T
A
= +25°C T
A
= +85°C
D-8
(1)
38.3 95 1.05 W 421 mW
DGN-8
(2)
4.7 58.4 1.71 W 685 W
(1) These data were taken using the JEDEC standard low-K test PCB. For the JEDEC proposed high-K test PCB, the θ
JA
is +95°C/W with
power rating at T
A
= +25°C of 1.05 W.
(2) These data were taken using 2 oz. (56,7 grams) trace and copper pad that is soldered directly to a 3 inch x 3 inch (76,2 mm x 76,2 mm)
PCB. For further information, see the Application Information section of this data sheet.
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