Datasheet
THS3120
THS3121
www.ti.com
........................................................................................................................................ SLOS420E –SEPTEMBER 2003–REVISED OCTOBER 2009
RECOMMENDED OPERATING CONDITIONS
PARAMETER MIN NOM MAX UNIT
Dual supply ±5 ±15
Supply voltage V
Single supply 10 30
Commercial 0 +70
Operating free-air temperature, T
A
°C
Industrial –40 +85
Operating junction temperature, continuous operating, T
J
–40 +125 °C
Normal storage temperature, T
STG
–40 +85 °C
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature, unless otherwise noted.
PARAMETER UNIT
Supply voltage, V
S–
to V
S+
33 V
Input voltage, V
I
±V
S
Differential input voltage, V
ID
±4 V
Output current, I
O
(2)
550 mA
Continuous power dissipation See Dissipation Ratings Table
Maximum junction temperature, T
J
(3)
+150°C
Maximum junction temperature, continuous operation, long-term reliability, T
J
(4)
+125°C
Commercial 0°C to +70°C
Operating free-air temperature, T
A
Industrial –40°C to +85°C
Storage temperature, T
STG
–65°C to +125°C
HBM 1000
ESD ratings: CDM 1500
MM 200
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The THS3120 and THS3121 may incorporate a PowerPAD on the underside of the chip. This acts as a heatsink and must be connected
to a thermally dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature
which could permanently damage the device. See TI Technical Brief SLMA002 for more information about using the PowerPAD
thermally-enhanced package.
(3) The absolute maximum temperature under any condition is limited by the constraints of the silicon process.
(4) The maximum junction temperature for continuous operation is limited by the package constraints. Operation above this temperature
may result in reduced reliability and/or lifetime of the device.
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Product Folder Link(s): THS3120 THS3121