Datasheet
THS3110
THS3111
www.ti.com
........................................................................................................................................ SLOS422E –SEPTEMBER 2003–REVISED OCTOBER 2009
RECOMMENDED OPERATING CONDITIONS
MIN NOM MAX UNIT
Dual supply ±5 ±15
Supply voltage V
Single supply 10 30
Commercial 0 +70
Operating free-air temperature, T
A
Industrial –40 +85
°C
Operating junction temperature, continuous operating temperature, T
J
–40 +125
Normal storage temperature, T
STG
–40 +85
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature, unless otherwise noted.
UNIT
Supply voltage, V
S–
to V
S+
33 V
Input voltage, V
I
± V
S
Differential input voltage, V
ID
± 4 V
Output current, I
O
(2)
300 mA
Continuous power dissipation See Dissipation Ratings Table
Maximum junction temperature, T
J
(3)
+150°C
Maximum junction temperature, continuous operation, long term reliability, T
J
(4)
+125°C
Commercial 0°C to +70°C
Operating free-air temperature, T
A
Industrial –40°C to +85°C
Storage temperature, T
stg
–65°C to +125°C
ESD ratings:
HBM 900
CDM 1500
MM 200
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The THS3110 and THS3111 may incorporate a PowerPAD on the underside of the chip. This feature acts as a heatsink and must be
connected to a thermally dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction
temperature which could permanently damage the device. See TI Technical Brief SLMA002 for more information about utilizing the
PowerPAD™ thermally-enhanced package.
(3) The absolute maximum temperature under any condition is limited by the constraints of the silicon process.
(4) The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may
result in reduced reliability and/or lifetime of the device.
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