Datasheet

1
2
3
4
8
7
6
5
NC
V
IN −
V
IN +
V
S−
NC
V
S+
V
OUT
NC
NC =NoInternalConnection
NOTE:Thedevicewiththepower-downoptiondefaultstotheONstateifnosignalisappliedtothePDpin.Additionally,theREFpin
functionalrangeisfromV to(V 4V).
S S+-
-
1
2
3
4
8
7
6
5
REF
V
IN−
V
IN+
V
S−
V
S+
V
OUT
NC
NC=NoInternalConnection
PD
THS3110 THS3111
D,DGNTOPVIEW D,DGNTOPVIEW
THS3110
THS3111
SLOS422E –SEPTEMBER 2003–REVISED OCTOBER 2009........................................................................................................................................ www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
AVAILABLE OPTIONS
(1)
PACKAGED DEVICE
T
A
PLASTIC SMALL OUTLINE SOIC (D) PLASTIC MSOP (DGN)
(2)
SYMBOL
THS3110CD THS3110CDGN
0°C to +70°C BJB
THS3110CDR THS3110CDGNR
THS3110ID THS3110IDGN
–40°C to +85°C BIR
THS3110IDR THS3110IDGNR
THS3111CD THS3111CDGN
0°C to +70°C BJA
THS3111CDR THS3111CDGNR
THS3111ID THS3111IDGN
–40°C to +85°C BIS
THS3111IDR THS3111IDGNR
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) The PowerPAD is electrically isolated from all other pins.
DISSIPATION RATINGS TABLE
POWER RATING
T
J
= +125°C
PACKAGE θ
JC
(°C/W) θ
JA
(°C/W)
T
A
= +25°C T
A
= +85°C
D-8
(1)
38.3 95 1.05 W 421 mW
DGN-8
(2)
4.7 58.4 1.71 W 685 mW
(1) These data were taken using the JEDEC standard low-K test PCB. For the JEDEC proposed high-K test PCB, the θ
JA
is 95°C/W with
power rating at T
A
= +25°C of 1.05 W.
(2) These data were taken using 2 oz. trace and copper pad that is soldered directly to a 3 inch × 3 inch (76,2 mm × 76,2 mm) PCB. For
further information, refer to the Application Information section of this data sheet.
2 Submit Documentation Feedback Copyright © 2003–2009, Texas Instruments Incorporated
Product Folder Link(s): THS3110 THS3111