Datasheet
D, DDATOP VIEW
1
2
3
4
8
7
6
5
NC
V
IN−
V
IN+
V
S−
NC
V
S+
V
OUT
NC
NC = No Internal Connection
THS3091
Note A: The devices with the power−down option defaults to the ON state if no signal is applied to the PD pin. Additionallly, the REF
pin functional range is from V
S−
to (V
S+
− 4 V).
1
2
3
4
8
7
6
5
REF
V
IN−
V
IN+
V
S−
PD
V
S+
V
OUT
NC
D, DDATOP VIEW
THS3095
NC = No Internal Connection
See Note A.
DISSIPATION RATINGS TABLE
THS3091
THS3095
SLOS423G – SEPTEMBER 2003 – REVISED OCTOBER 2008 ........................................................................................................................................
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
(1)
PART NUMBER PACKAGE TYPE TRANSPORT MEDIA, QUANTITY
THS3091D Rails, 75
SOIC-8
THS3091DR Tape and Reel, 2500
THS3091DDA Rails, 75
SOIC-8-PP
(2)
THS3091DDAR Tape and Reel, 2500
Power-down
THS3095D Rails, 75
SOIC-8
THS3095DR Tape and Reel, 2500
THS3095DDA Rails, 75
SOIC-8-PP
(2)
THS3095DDAR Tape and Reel, 2500
(1) For the most current package and ordering information see the Package Option Addendum at the end
of this document, or see the TI web site at www.ti.com .
(2) The PowerPAD is electrically isolated from all other pins.
POWER RATING
(2)
T
J
= 125 ° C
PACKAGE θ
JC
( ° C/W) θ
JA
( ° C/W)
(1)
T
A
= 25 ° C T
A
= 85 ° C
D-8 38.3 97.5 1.02 W 410 mW
DDA-8
(3)
9.2 45.8 2.18 W 873 mW
(1) This data was taken using the JEDEC standard High-K test PCB.
(2) Power rating is determined with a junction temperature of 125 ° C. This is the point where distortion starts to substantially increase.
Thermal management of the final PCB should strive to keep the junction temperature at or below 125 ° C for best performance and
long-term reliability.
(3) The THS3091 and THS3095 may incorporate a PowerPAD™ on the underside of the chip. This acts as a heatsink and must be
connected to a thermally dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction
temperature which could permanently damage the device. See TI Technical Brief SLMA002 for more information about utilizing the
PowerPAD™ thermally enhanced package.
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