Datasheet
www.ti.com
1
2
3
4
8
7
6
5
1V
OUT
1V
IN−
1V
IN+
V
S−
V
S+
2V
OUT
2V
IN−
2V
IN+
D, DDATOP VIEW
THS3092
NC = No Internal Connection
D, PWPTOP VIEW
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1V
OUT
1V
IN−
1V
IN+
V
S−
V
S+
2V
OUT
2V
IN−
2V
IN+
NC = No Internal Connection
THS3096
See Note A.
NC
REF
NC
NC
PD
NC
Note A: The devices with the power down option defaults to the ON state if no signal is applied to the PD pin. Additionallly, the REF pin
functional range is from V
S−
to (V
S+
− 4 V).
DISSIPATION RATING TABLE
THS3092
THS3096
SLOS428B – DECEMBER 2003 – REVISED FEBRUARY 2006
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
PART NUMBER PACKAGE TYPE TRANSPORT MEDIA, QUANTITY
THS3092D Rails, 75
SOIC-8
THS3092DR Tape and Reel, 2500
THS3092DDA Rails, 75
SOIC-8-PP
(1)
THS3092DDAR Tape and Reel, 2500
Power-down
THS3096D Rails, 75
SOIC-8
THS3096DR Tape and Reel, 2500
THS3096PWP Rails, 90
TSSOP-14-PP
(1)
THS3096PWPR Tape and Reel, 2000
(1) The PowerPAD is electrically isolated from all other pins.
POWER RATING
(2)
PACKAGE Θ
JC
(°C/W) Θ
JA
(°C/W)
(1)
T
A
≤ 25°C T
A
= 85°C
D-8 38.3 97.5 1.02 W 410 mW
DDA-8
(3)
9.2 45.8 2.18 W 873 mW
PWP-14
(3)
2.07 37.5 2.67 W 1.07 W
(1) This data was taken using the JEDEC standard High-K test PCB.
(2) Power rating is determined with a junction temperature of 125°C. This is the point where distortion starts to substantially increase.
Thermal management of the final PCB should strive to keep the junction temperature at or below 125°C for best performance and long
term reliability.
(3) The THS3092 and THS3096 may incorporate a PowerPAD™ on the underside of the chip. This acts as a heatsink and must be
connected to a thermally dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction
temperature which could permanently damage the device. See TI Technical Brief SLMA002 for more information about utilizing the
PowerPAD™ thermally enhanced package.
2
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