Datasheet

ADDITIONAL REFERENCE MATERIAL
THS3091
THS3095
www.ti.com ........................................................................................................................................ SLOS423G – SEPTEMBER 2003 – REVISED OCTOBER 2008
Table 2. Bill of Materials
THS3091DDA and THS3095DDA EVM
(1)
SMD REFERENCE PCB MANUFACTURER'S DISTRIBUTOR'S
ITEM DESCRIPTION
SIZE DESIGNATOR QTY PART NUMBER PART NUMBER
1 Bead, Ferrite, 3 A, 80 Ω 1206 FB1, FB2 2 (Steward) HI1206N800R-00 (Digi-Key) 240-1010-1-ND
2 Cap, 6.8 µ F, Tantalum, 50 V, 10% D C3, C6 2 (AVX) TAJD685K050R (Garrett) TAJD685K050R
3 Cap, 0.1 µ F, ceramic, X7R, 50 V 0805 C9, C10 2
(2)
(AVX) 08055C104KAT2A (Garrett) 08055C104KAT2A
4 Cap, 0.1 µ F, ceramic, X7R, 50 V 0805 C4, C7 2 (AVX) 08055C104KAT2A (Garrett) 08055C104KAT2A
5 Resistor, 0 Ω , 1/8 W, 1% 0805 R9 1
(2)
(KOA) RK73Z2ALTD (Garrett) RK73Z2ALTD
6 Resistor, 249 Ω , 1/8 W, 1% 0805 R3 1 (KOA) RK73H2ALTD2490F (Garrett) RK73H2ALTD2490F
7 Resistor, 1 k Ω , 1/8 W, 1% 0805 R4 1 (KOA) RK73H2ALTD1001F (Garrett) RK73H2ALTD1001F
8 Open 1206 R8 1
9 Resistor, 0 Ω , 1/4 W, 1% 1206 R1 1 (KOA) RK73Z2BLTD (Garrett) RK73Z2BLTD
10 Resistor, 49.9 Ω , 1/4 W, 1% 1206 R2, R7 2 (KOA) RK73Z2BLTD49R9F (Garrett) RK73Z2BLTD49R9F
11 Open 2512 R5, R6 2
Header, 0.1-inch (2,54 mm) centers,
12 JP1, JP2 2
(2)
(Sullins) PZC36SAAN (Digi-Key) S1011-36-ND
0.025-inch (6,35 mm) square pins
13 Connector, SMA PCB Jack J1, J2, J3 3 (Amphenol) 901-144-8RFX (Newark) 01F2208
Jack, banana receptacle,
14 J4, J5, J6 3 (SPC) 813 (Newark) 39N867
0.25-inch (6,35 mm) dia. hole
15 Test point, black TP1, TP2 2 (Keystone) 5001 (Digi-Key) 5001K-ND
Standoff, 4-40 hex,
16 4 (Keystone) 1808 (Newark) 89F1934
0.625-inch (15,9 mm) length
Screw, Phillips, 4-40,
17 4 SHR-0440-016-SN
0.25-inch (6,35 mm)
IC, THS3091(3) (TI) THS3091DDA
(3)
18 U1 1
IC, THS3095(2) (TI) THS3095DDA
(2)
(TI) EDGE # 6446289 Rev. A
(3)
19 Board, printed-circuit 1
(TI) EDGE # 6446290 Rev. A
(2)
(1) All items are designated for both the THS3091DDA and THS3095 EVMs unless otherwise noted.
(2) THS3095 EVM only.
(3) THS3091 EVM only.
• PowerPAD™ Made Easy, application brief (SLMA004 )
• PowerPAD™ Thermally Enhanced Package, technical brief (SLMA002 )
• Voltage Feedback vs Current Feedback Amplifiers, (SLVA051 )
• Current Feedback Analysis and Compensation (SLOA021 )
• Current Feedback Amplifiers: Review, Stability, and Application (SBOA081 )
• Effect of Parasitic Capacitance in Op Amp Circuits (SLOA013 )
• Expanding the Usability of Current-Feedback Amplifiers, 3Q 2003 Analog Applications Journal
(www.ti.com/sc/analogapps ).
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Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision F (February, 2007) to Revision G ............................................................................................ Page
• Changed common-mode rejection ratio specifications from 78 dB (typ) to 69 dB (typ); from 68 dB at +25 ° C to 62
dB; from 65 dB at (0 ° C to +70 ° C) and ( – 40 ° C to +85 ° C) to 59 dB. ...................................................................................... 4
• Corrected load resistor value for output current specification (sourcing and sinking) from R
L
= 40 Ω to R
L
= 10 Ω ............ 7
• Changed output current (sourcing) specifications from 200 mA (typ) to 180 mA (typ); from 160 mA at +25 ° C to 140
mA; from 140 mA at (0 ° C to +70 ° C) and ( – 40 ° C to +85 ° C) to 120 mA ................................................................................ 7
• Corrected output current (sinking) specifications from 180 mA (typ) to – 160 mA (typ); from 150 mA at +25 ° C to – 140
mA; from 125 mA at (0 ° C to +70 ° C) and ( – 40 ° C to +85 ° C) to – 120 mA .............................................................................. 7
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